Company: Bosch Packaging Technology
Daniel Bossel is Global Product Manager at Bosch Packaging Technology. He is based in Beringen, Switzerland. Since 2011, Daniel is responsible for biscuit packaging systems, ranging from biscuit processing up to retail packaging.
He started his packaging curriculum in the pharmaceutical industry. Afterwards, he worked at Amcor Ltd. where he was responsible for packaging material science and innovations for more than ten years.